What is the Heat Dissipation Technique of PCB Circuit Board?

As a PCB Manufacturer, share with you. High heat-generating device plus heat sink and heat-conducting board When a few devices in the PCB have a large amount of heat (less than 3), a heat sink or heat pipe can be added to the heat-generating device. Radiator with fan to enhance heat dissipation.

When the amount of heating devices is large, a large heat sink can be used. It is a special heat sink customized according to the position and height of the heating device on the PCB Bare Board, or a high flat heat sink is used to cut out different components.

The heat sink is integrally buckled on the surface of the component, and contacts each component to dissipate heat. However, the heat dissipation effect is not good due to the poor consistency of the components when mounting and welding. Generally, a soft thermal phase change thermal pad is added on the component surface to improve the heat dissipation effect.

For equipment using free convection air cooling, it is better to arrange integrated circuits (or other devices) in a lengthwise manner, or in a horizontal lengthwise manner.

Adopt reasonable wiring design to achieve heat dissipation. Due to the poor thermal conductivity of the resin in the plate, and copper foil lines and holes are good conductors of heat, increasing the copper foil residual rate and increasing the heat conduction holes are the main means of heat dissipation. To evaluate the heat dissipation capability of a PCB, it is necessary to calculate the equivalent thermal conductivity (nine eq) of a composite material composed of various materials with different thermal conductivity, one by one, for an insulating substrate for a PCB.

The devices on the same printed board should be arranged as much as possible according to the amount of heat generated and the degree of heat dissipation. Devices with low heat generation or poor heat resistance (such as small signal transistors, small-scale integrated circuits, electrolytic capacitors, etc.) are placed in the cooling airflow. Is relatively high (at the entrance), and devices with large heat generation or good heat resistance (such as power transistors, large-scale integrated circuits, etc.) are placed relatively downstream of the cooling airflow.

In the horizontal direction, high-power devices are arranged as close to the edge of the printed board as possible to shorten the heat transfer path; in the vertical direction, high-power devices are arranged as close to the printed board as possible to reduce the impact of these devices on the temperature of other devices during operation.

The heat dissipation of the printed board in the device mainly depends on the air flow, so the air flow path should be researched in the design, and the device or printed circuit board should be reasonably configured.

When air flows, it tends to flow in a place with low resistance, so when configuring the device on the printed circuit board, avoid leaving a large airspace in a certain area. The configuration of multiple printed circuit boards in the whole machine should also pay attention to the same problem.

Our company also has Prototype PCB on sale, welcome to consult.