High-Accuracy Die Bonder

A die bonder is a high-precision semiconductor packaging machine used to pick and place bare semiconductor dies onto substrates, lead frames, or wafers with micron or sub-micron accuracy.

Automatic Pin Inspection Equipment

Automatic Pin Inspection Equipment is a high-precision industrial inspection system designed to automatically detect, measure, and verify the quality, alignment, and dimensional accuracy of pins used

AMB Vision Inspection Equipment

AMB Vision Inspection Equipment refers to a high-precision automated optical inspection system used in advanced manufacturing to detect defects, measure dimensions, and verify alignment of components

Thermal Bonding Machine

Coreal Tech provides advanced thermal bonding machines for semiconductor packaging, thermo-compression bonding, flip chip assembly, and high-precision IC packaging applications.

Automated Semiconductor Production Line Equipment

An Automated Semiconductor Packaging and Testing Line is a fully integrated semiconductor manufacturing system that combines back-end packaging processes and final electrical testing into a continuous