What are the Five Major Trends in the Development of PCB Technology?

As a PCB Company, share with you. Electronic equipment requires high performance, high speed, thinness and shortness. As a multidisciplinary industry, PCB is the most critical technology for high-end electronic equipment. PCB products, regardless of rigid, flexible, rigid-flex combined multilayer boards, and module substrates for IC packaging substrates, have made great contributions to high-end electronic equipment. PCB proofing plays an important role in the electronic interconnection technology of the PCB industry. Human beings have entered a highly information society, and PCB is an indispensable and important pillar in the information industry.

Regarding the current development trend of PCB technology, there are the following points:

First, development along the road of high-density interconnect technology (HDI)

Since HDI embodies the most advanced technology of contemporary PCBs, it brings fine wiring and micro-apertures to PCBs. HDI multilayer boards are used in terminal electronic products-mobile phones are a model of HDI cutting-edge development technology. In mobile phones, the fine wires of PCB motherboards have become mainstream, and in addition, the conductive layer and the thickness of the board have been reduced; the miniaturization of conductive patterns has brought about high density and high performance of electronic equipment.

For more than two decades, HDI has promoted the development of mobile phones, the development of LSI and CSP chips for information processing and control of basic frequency functions, and the development of template substrates for packaging. It also promotes the development of PCBs.

Second, the component embedding technology has strong vitality

The formation of semiconductor devices, electronic components or passive component functions in the inner layer of the PCB. "Component Embedded PCB" has begun mass production. Component embedded technology is a huge change in PCB functional integrated circuits, but to develop analog design methods, Production technology and inspection quality and reliability assurance are top priorities.

In order to maintain a strong vitality, we need to invest more resources in systems including design, equipment, testing, and simulation.

Third, the development of materials in PCB must go to the next level

Whether it is a rigid PCB or a Flexible PCB, with the global lead-free of electronic products, it is required to make these materials more heat resistant, so new materials with high Tg, small thermal expansion coefficient, small dielectric constant, and good dielectric loss tangent are emerging .

Fourth, the optoelectronic PCB has a bright future

It uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is to make the optical path layer. It is an organic polymer formed by lithography, laser ablation, and reactive ion etching. Fifth, the manufacturing process must be updated, and advanced equipment must be introduced.

Manufacturing process

2. Advanced equipment

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