How is the Automatic Glue Dispensing Machine applied in the chip packaging industry?

How is the Automatic Glue Dispensing Machine applied in the chip packaging industry? With the continuous development of society, today's era is an era of informationization. Semiconductors and integrated circuits have become the theme of today's era. The direct impact on the mechanical properties of semiconductors and integrated circuits is the process of chip packaging. Chip packaging has always been industrial. A big problem in production, how does the automatic dispensing machine overcome this problem, and how is it applied in the chip packaging industry?

Automatic Glue Dispensing Machine

With the continuous development of society, today's era is an era of informationization. Semiconductors and integrated circuits have become the theme of today's era. The direct impact on the mechanical properties of semiconductors and integrated circuits is the process of chip packaging. Chip packaging has always been industrial. A big problem in production, so how does the automatic dispensing machine overcome this problem, and how is it applied in the chip packaging industry? Here is an analysis of the Automated Dispensing Solution Provider!

How is the automatic dispenser used in the chip packaging industry?

First, chip bonding

The PCB is easy to shift during the bonding process. In order to prevent the electronic components from falling off or shifting from the PCB surface, we can use an automatic dispensing machine to dispense the PCB surface and then heat it in an oven to cure. The electronic components can be firmly attached to the PCB.

Second, the bottom material filling

It is believed that many technicians have encountered such problems. During the flip-chip mounting, because the fixed area is smaller than the chip area, it is difficult to adhere. If the chip is impacted or expands due to heat, it is easy to cause bumps to break. , The chip will lose its proper performance. In order to solve this problem, we can inject organic glue into the gap between the chip and the substrate through an automatic dispenser, and then solidify. This effectively increases the connection between the chip and the substrate. The area further improves its bonding strength and has a good protection effect on the bumps.

Third, the surface coating

After the chip is soldered, we can use an automatic dispenser to apply and cure a layer of epoxy resin with low viscosity and good fluidity between the chip and the solder joint. This way the chip not only improves the appearance of the chip, but also can prevent foreign objects from eroding and stimulating can protect the chip and prolong the service life of the chip!

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