Pressure Sensor Medical Electronic Care Device PCB Board Assembly

Pressure Sensor Medical Electronic Care Device PCB Board Assembly

Industry-specific attributes

Base Material FR4/ALU/FPC

Board Thickness 0.4MM/0.6MM/0.8MM/1MM/1.6MM

Other attributes

Model Number

Place of Origin Guangdong, China

Copper Thickness 0.5OZ/1OZ

Min. Hole Size 0.075mm

Min. Line Width 0.075mm

Min. Line Spacing 0.075mm

Surface Finishing immersion gold/ENIG/HASL

Board Size Custom

MOQ 1pcs

Service One-Stop OEM Service

Customize Avaliable

PCB Standard IPC-II Standard Shape Irregular

Package Vaccum Package

Capacity High Dirt Holding Capacity

Test service 100% E-Testing

Technics Reflow/soldering

Product name Sensor Medical PCB PCBA Circuit Board Assembly Contract Manufacturer

Thriver Digital Tech – Best Choice for PCB Electronic Board Assembly

During the process of PCB design and PCB manufacturing, our company adopts a series of systematic methods to ensure that each link can achieve high standards of quality and efficiency.

PCB Design Process

Requirement Analysis

Before the PCB electronic board assembly design begins, we first communicate with customers to understand the functional requirements, performance indicators and physical dimensions of their products. This step ensures that we can tailor the PCB design for our customers.

Schematic Design

Engineers use professional PCB design software to create a schematic diagram of the circuit to clarify the function of the circuit and the placement of components. The accuracy of the schematic is crucial for subsequent PCB manufacturing.

Layout Planning

After the schematic is completed, we carry out PCB layout planning. This includes considering factors such as signal flow, electromagnetic compatibility, thermal management, and power distribution to optimize the performance of the circuit board.

Design Rule Checking

We use automated tools to check whether the design meets specific design rules, including trace width, spacing, etc., to ensure that the design meets manufacturing and electrical specifications.

Signal and Thermal Analysis

Signal integrity analysis and thermal analysis are performed through simulation software to ensure that the PCB can work stably under high load.

Output photolithography file

Finally, we convert the design into a photolithography file, which directly affects the quality and accuracy of the subsequent photolithography process.

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