What is COG?

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COG stands for Chip on Glass. There are many different types of displays. COB (Chip on Board), COF (Chip on Flex), TAB (Tape automated bonding) and COG.

This is an LCD technology where the controller chip used to drive the LCD is mounted directly onto the LCD glass.

Mounting the controller directly onto the LCD glass allows the module to be built without the need for a PCB. The three main components of a chip on glass is the glass, the controller driver chip, and the cable.

As a general rule the cost of a COG is less than that of a COB. Without being mounted to a circuit board, COG displays do not come equipped with mounting holes. Instead the COG display is mounted to the chassis if the manufacturer’s product uses double-sided tape.

COG LCD Manufacturer for COG LCD Module

COG is an advanced technology to adhere IC chips onto glass(LCD). By Flip Chip technology, a gold bumped IC chip is connected to the ITO of LCD panels with ACF as a media. When this technology is applied to LCD panels due to the circuit board being glass, it is so-called Chip on Glass (COG), and bonding of the flexible printed circuit(FPC) and glass(LCD) is called FOG(Film On Glass). COG would be produced by means of wafer to tray. After LCD panel module factory acquires IC, the gold bump of the IC is bonded to the circuit board of LCD panels with ACF, then use ACF bonding with FPC, this production is called FOG process.

COG LCM Mounting Technology

Flip Chip On Glass By ACF

Outer Lead Bonding By ACF

Production Line

Products

Process

LCD Testing

LCD Loading C/V

LCD ITO Terminal Wiped and Washed by Plasma

COG IC Bonding Machine

COG ACF Tapping

COG IC Bonding I

COG IC Bonding II

LCD Visual Inspection

Microscope Inspection

ACF Tapping

FPC Bonding Machine

FPC Bonding

Silicone Injection I & Tape Tapping

FOG Function Inspection

Silicone Injection I

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