High Bay Lights LEDs Flip Chip
GT-FC300(SP1010)
Power:FC60-300W
Luminous area:13.48*13.48mm
RoHS compliant
5 Years Warranty
High CRI COB LED Chip Description
High Reliability and Stability
Ceramic base with flip chip mounted, no gold wire bonding
High heat conductivity red copper substrate
High temperature eutectic welding technique
Reliable raw materials applied with super fast heat transfer
Patented phosphor coating techonology
Outstanding Projecting Performance
High power & lux density with super even light distribution
Minimum distance in-between China Flip Chip for High Bay to achieve surface emitting effect
Extremely small LES optimized for focused lighting purpose
Flexible Application Features of High Stability Flip Chip
Equipped with temperature sensor and quick connector
A wide power range from 10W to 800W optional
High Bay Light Flip Chip Application: stage light, projector, searchlight and long-distance lighting applications,etc
Product Specification
Product Type | LES | CCT | CRI | φ | Power | VF | IF | Chip Array |
GT-FC60X3-1.1 | 6.66*6.66 | 8000-8500 | 70 | 4500-5000 | 60 | 15-19 | 3.75 | SP0505 |
GT-FC90X3-1.1 | 6.66*6.66 | 8000-8500 | 70 | 6300-7200 | 90 | 15-19 | 5.5 | SP0505 |
GT-FC150X3-1.1 | 9.64*9.64 | 8000-8500 | 70 | 10000-12000 | 150 | 21-25 | 6.7 | SP0707 |
GT-FC300X3-1.1 | 13.48*13.48 | 8000-8500 | 70 | 20000-22000 | 300 | 30-36 | 10 | SP1010 |
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Copyright：@2020-2021
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