How is Automatic Glue Dispensing Machine Used in the Chip Packaging Industry?

With the continuous development of society, today's era is an era of information technology. Semiconductors and integrated circuits have become the theme of today's era. What directly affects the mechanical performance of semiconductors and integrated circuits is the process of chip packaging. Chip packaging has always been an industry. A big problem in production, so how did Automatic Glue Dispensing Machine overcome this problem and how it was applied in the chip packaging industry? Please see the analysis of Automated Dispensing Solution Provider below!

Glue Dispensing Machine with PCB Board

How is the automatic dispenser used in the chip packaging industry?

First, chip bonding

PCB is easy to shift during the bonding process. In order to prevent the electronic components from falling off or shifting from the surface of the PCB, we can use automatic dispenser equipment to dispense on the surface of the PCB, and then put it in an oven for heating and curing The electronic components can be firmly pasted on the PCB.

Second, the bottom filling

It is believed that many technicians have encountered such problems. During the flip chip process, because the fixed area is smaller than the chip area, it is difficult to bond. If the chip is impacted or heated and expanded, it is easy to cause the breakage of the bump , The chip will lose its proper performance. In order to solve this problem, we can inject organic glue into the gap between the chip and the substrate through an automatic dispenser and then cure, which effectively increases the connection between the chip and the substrate. The area further improves their bonding strength and has a good protection for the bumps.

Third, the surface coating

After the chip is soldered, we can use an automatic dispenser to apply a layer of epoxy resin with low viscosity and good fluidity between the chip and the solder joint and cure, so that the chip not only improves the appearance of a grade, but also Preventing the erosion and irritation of foreign objects can play a very good role in protecting the chip and extend the service life of the chip!

In summary, the above is the application of the automatic dispenser in the chip packaging industry, chip bonding, primer filling, surface coating, etc. We can apply this method to the usual work, which will greatly improve Our work efficiency, with this method, we no longer have to worry about chip packaging problems!

Our company also has Glue Dispensing Machine with PCB Board for sale, please contact us.